A Glass-Ceramic Substrate for Next-Generation Semiconductor Packaging has been Developed
On June 5, Nippon Electric Glass Co., Ltd. announced the development of a glass-ceramic substrate (GC Core™) with significant potential applications in next-generation semiconductor packaging.
The GC Core™ developed by Nippon Electric Glass
In recent years, the increasing demand for data centers and the proliferation of technologies such as generative AI have led to an increase in data traffic, thereby increasing the demand for higher performance and lower power consumption semiconductors in the supporting infrastructure. To improve semiconductor performance, it is necessary to achieve circuit miniaturization, develop small chiplets, and enlarge the substrate. However, traditional resin substrates face challenges in circuit miniaturization and rigidity issues, such as deformation when multiple semiconductor chips are mounted or when the substrate is enlarged. Therefore, the development of glass substrates with excellent electrical performance, rigidity, and flatness as a next-generation material to replace resin substrates is progressing. The recently developed GC Core™ by Nippon Electric Glass is a substrate made of a composite material of glass powder and ceramic powder. In addition to having the characteristics of a glass substrate, it also has the advantage of being easy to process for microvias.
Features of the GC Core™ developed by Nippon Electric Glass:
1、CO2 Laser Drilling
It is necessary to form microvias on the core substrate to electrically connect the fine metal wiring formed on the front and back.
（1）Crack-Free, High-Speed Processing
For ordinary glass substrates, a certain proportion will crack when drilling with a CO2 laser, leading to substrate breakage. GC Core™, however, possesses the ceramic characteristics of being less deformable and less prone to cracking, allowing for high-speed, crack-free drilling.
（2）Cost-Effective, Potential for Reduced Mass Production Costs
Drilling on ordinary glass substrates typically involves laser modification and etching to avoid cracks, a technically demanding and time-consuming process that is costly. GC Core™ can be drilled using widely available CO2 laser machines, potentially reducing mass production costs.
The cross-section of microvias in the newly developed GC Core™ (SEM image)
2、Low Dielectric Constant and Low Dielectric Loss
The glass-ceramic material uses Nippon Electric Glass's proprietary LTCC (Low Temperature Co-fired Ceramic) material, which has a low dielectric constant and dielectric loss, reducing signal delay and dielectric loss.
3、Availability of Thin Substrates
GC Core™ is stronger than glass substrates and can be made into thinner substrates, facilitating the manufacture of thinner semiconductors. Additionally, its resistance to cracking makes it easier to handle during semiconductor packaging production.
4、Customized Specifications
The properties of GC Core™ depend on the composition and mixing ratio of glass and ceramic and can be customized according to customer requirements. In addition to the low dielectric constant type with excellent dielectric properties, Nippon Electric Glass also offers high expansion types that match the thermal expansion of resin substrates and high-strength types, enabling the development of substrates for a wide range of applications.
Nippon Electric Glass has successfully developed a 300mm substrate and is currently working on expanding it to 515×510mm by the end of 2024.
Source: Nippon Electric Glass Co., Ltd.
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