Aluminum Nitride (AlN)

Aluminum Nitride (AlN) ceramic features high thermal conductivity (≥170 W/m·K), excellent electrical insulation, and low thermal expansion, making it ideal for heat dissipation and electronic packaging, especially for high-power and high-frequency electronics. Like other ceramic materials, it exhibits high hardness, excellent mechanical strength, corrosion resistance, and high-temperature stability, making it suitable for structural components in harsh environments.

AlN ceramics offer excellent thermal stability, retaining their properties above 2000°C in inert atmospheres. In air, oxidation starts at approximately 600–700°C, forming a protective Al2O3 layer that slows further oxidation. This layer remains stable up to around 1370°C, but at higher temperatures, oxidation may progress, potentially impacting the material’s integrity.

Properties

• High hardness and excellent mechanical strength

• Excellent high-temperature resistance

• Thermal expansion similar to that of silicon

• Superior thermal conductivity

• Excellent corrosion resistance

• Non-toxic and environmentally friendly

• High electrical breakdown strength

• Low dielectric constant and minimal dielectric loss

Data Sheet

Applications

• Semiconductor Equipment Modules

• Optical Communication & RF Modules

• LED & Laser Packaging Modules

• Power Electronics Modules

• Thermal Management Components

• High-Frequency Microwave & Radar Modules

• Medical & Sensing Modules

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