Alumina Substrate

Mascera is a professional supplier for technical ceramic parts, we provide custom manufacturing for alumina ceramics, zirconia ceramics, boron nitride ceramics, silicon nitride ceramics, silicon carbide ceramics, aluminum nitride ceramics and machinable glass ceramics.

One of our hot selling products is ceramic substrate for electronic package applications. The materials of ceramic substrates we can produce are 96% alumina ceramic and aluminum nitride ceramic. Both have good electrical insulation, good mechanical strength and high heat resistance. Product size could be customized accroding to your request, delivery date could be within 7 days at the fastest.

Any inquiry please email info@mascera-tec.com or call +86 13860446139

96% Alumina substrates are the most cost-effective and commonly used ceramic substrate for thick film electronics or power powdules, they are made of electrically insulated 96% alumina (al2o3) ceramic. Alumina substrates have advantages of good electrical insulation, low dielectric properties, good heat resistance and wear resistance. The good thermal conductivity will help electronic modules to dissipate heat efficiently. The shape is stable because of the high strength and good durability, the surface is smooth and flatness is as good as 2‰ of dimensions.

Any inquiry please email info@mascera-tec.com or call +86 13860446139

Ceramic PCBs have much beter heat dissipation performance, current-carrying capacity, electrical insulation, thermal expansion coefficient than ordinary glass fiber PCB board. Unlike ordinary PCBs, which use adhesives to bond copper foil and substrate together, ceramic PCBs are produced by bonding the copper foil and ceramic substrate directly in a high temperature environment. Ceramic PCBs have strong bonding force, copper foil will not fall off, leading to high reliability and stable performance under high temperature and high humidity environment. Ceramic PCBs are widely used in high-power electronic modules, aerospace, military electronics and other products.

Any inquiry please email info@mascera-tec.com or call +86 13860446139

DBC(Direct Bonded Copper) is one of the main metallization for ceramic substrates. The copper foils can be directly bonded on single or double surfaces of ceramic substrates (alumina ceramic or aluminum nitride) without a middle layer, reducing the contact thermal resistance between the metal layer and the ceramic layer, getting better heat dissipcation capability.

DBC substrates have not only the characteristics of high thermal conductivity, high electrical insulation, high mechanical strength, and low expansion of ceramics of ceramics, but also the high electrical conductivity and excellent soldering performance of oxygen-free copper, and can be carved into various graphics like a PCB circuit board.

Any inquiry please email info@mascera-tec.com or call +86 13860446139