dbc substrate

DBC(Direct Bonded Copper) is one of the main metallization for ceramic substrates. The copper foils can be directly bonded on single or double surfaces of ceramic substrates (alumina ceramic or aluminum nitride) without a middle layer, reducing the contact thermal resistance between the metal layer and the ceramic layer, getting better heat dissipcation capability. DBC substrates have not only the characteristics of high thermal conductivity, high electrical insulation, high mechanical strength, and low expansion of ceramics of ceramics, but also the high electrical conductivity and excellent soldering performance of oxygen-free copper, and can be carved into various graphics like a PCB circuit board. Any inquiry please email info@mascera-tec.com or call +86 13860446139