News

High-temperature ceramic materials are essential in modern industries where extreme conditions are common, such as aerospace, energy production, electronics, and advanced manufacturing. These materials exhibit exceptional properties like high thermal resistance, mechanical strength, and durability under harsh conditions.

Alumina ceramic substrate is an essential material in the automobile industry, offering exceptional comprehensive performance that plays a significant role in automobile engines, sensors, shock absorbers, etc.

3C Electronics—Consumer Electronics, Computers, and Communication Devices—is a rapidly growing, innovative industry. As devices become more compact and multifunctional, materials face higher demands. Substrates, key structural and circuit components, are crucial to this progress.

Boron nitride atomizer nozzles for powder metal atomization play a crucial role in the atomization process. These nozzles are responsible for converting molten metal into fine powder particles, which are then used in various industries such as automotive, aerospace, and electronics.

The research shows that rapid heat dissipation and temperature equalization can be achieved by using the high thermal conductivity and high insulation of ceramics. Aluminum nitride ceramic substrates are currently used more frequently.

A crucible is a container used to heat or melt substances at high temperatures. Modern crucibles can be made from any material resistant to high temperatures, with pyrolytic boron nitride (PBN) being one of these materials. Crucibles are often equipped with lids, though the lids are not sealed tightly to allow gases to escape during heating.

Recently, Kyocera announced the development of a new silicon nitride ceramic material for functional testing of next-generation microchips. This new material boasts enhanced thermal expansion properties and flexural strength, enabling the production of thin silicon nitride plates with extremely narrow spacing between contact probes, which is critical for testing next-generation microchips.

Recently, KYOCERA held a groundbreaking ceremony for its fine ceramics factory for medical implants, located in Waiblingen, near Stuttgart, Germany. This facility will specialize in manufacturing high-quality ceramic heads used in hip prostheses and other implant applications. The project is expected to be completed by September next year.

Recently, Alpha HPA, an Australian company, has commenced construction on the second phase of the world’s largest single-location ultra-high-purity alumina refinery.

According to data from QY Research, the global market size for silicon carbide (SiC) ceramics used in semiconductors was $1.111 billion in 2023. Driven by the rigid demand from downstream industries, it is projected that the silicon carbide ceramics market will grow to $1.578 billion by 2030, with a compound annual growth rate (CAGR) of 5.09% from 2024 to 2030.

A research team at Ritsumeikan University in Japan has developed a new Electrochemical Mechanical Polishing (ECMP) technology, achieving a material removal rate of approximately 15 μm/h, significantly enhancing SiC polishing.

On June 5, Nippon Electric Glass Co., Ltd. announced the development of a glass-ceramic substrate (GC Core™) with significant potential applications in next-generation semiconductor packaging.