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Machines and equipment in manufacturing processing are often exposed to high stresses caused by temperature, pressure, corrosion, and abrasion. In such cases, ceramic materials on an oxide and non-oxide basis are often a suitable alternative for the designers. In this connection, an exact knowledge of the application conditions is crucial for the selection of the right material. Advanced ceramics are a good choice.

Ceramic materials are indispensable in electronic devices such as smartphones, computers, and televisions. Technical ceramic materials have superior electrical and magnetic properties. Ceramics are generally lighter and smaller than metallic materials.

Alumina Ceramic Rods are commonly used in various industrial applications, including heat exchangers, due to their excellent thermal and mechanical properties. Alumina, or aluminum oxide (Al2O3), is a ceramic material that offers high heat resistance, good thermal conductivity, and corrosion resistance.

Pyrolytic Boron Nitride (PBN) crucibles are a great choice for many high-temperature processes. These crucibles offer several benefits, like good heat transfer, high purity, resistance to chemicals, and surfaces that do not stick. Knowing these advantages can help businesses improve their work and get better results.

Boron Nitride is an advanced ceramic material synthesized from hexagonal boron nitride and is often referred to as "white graphite" due to its white appearance. Boron nitride exists in various structural forms and manufacturing processes, resulting in different types of boron nitride materials, such as hot-pressed boron nitride and pyrolytic boron nitride, each with distinct properties and applications.

Alumina ceramic rods are rod-shaped products made from high-purity alumina (Al₂O₃) and are widely used across various industrial fields. Due to their exceptional physical, chemical, and mechanical properties, they excel in extreme environments involving high temperatures, high pressures, and chemical corrosion.

Recently, Kyocera announced the development of a new silicon nitride ceramic material for functional testing of next-generation microchips. This new material boasts enhanced thermal expansion properties and flexural strength, enabling the production of thin silicon nitride plates with extremely narrow spacing between contact probes, which is critical for testing next-generation microchips.

Recently, KYOCERA held a groundbreaking ceremony for its fine ceramics factory for medical implants, located in Waiblingen, near Stuttgart, Germany. This facility will specialize in manufacturing high-quality ceramic heads used in hip prostheses and other implant applications. The project is expected to be completed by September next year.

Recently, Alpha HPA, an Australian company, has commenced construction on the second phase of the world’s largest single-location ultra-high-purity alumina refinery.

According to data from QY Research, the global market size for silicon carbide (SiC) ceramics used in semiconductors was $1.111 billion in 2023. Driven by the rigid demand from downstream industries, it is projected that the silicon carbide ceramics market will grow to $1.578 billion by 2030, with a compound annual growth rate (CAGR) of 5.09% from 2024 to 2030.

A research team at Ritsumeikan University in Japan has developed a new Electrochemical Mechanical Polishing (ECMP) technology, achieving a material removal rate of approximately 15 μm/h, significantly enhancing SiC polishing.

On June 5, Nippon Electric Glass Co., Ltd. announced the development of a glass-ceramic substrate (GC Core™) with significant potential applications in next-generation semiconductor packaging.