aluminum nitride substrate

Aluminum nitride substrates are widely applied in large-scale integrated circuits or high power modules because of much higher thermal conductivity than other ceramic materials. Aluminum nitride susbtrates's thermal conductivity is as high as 170 w/mk, which will dissipate heat and cool down the circuits much more quickly. Adding with good insulating properties, aluminum nitride substrates are the best solution in electronics applications where fast heat dissipation is critical. Alumium nitride substrates are heat resistant and have similar expansion coefficient of silicon, which will keep high reliability of Si chip and thermal heat cycling. Any inquiry please email info@mascera-tec.com or call +86 13860446139

Aluminum nitride sheets are made of high thermally conductive aluminum nitride ceramic, the thermal conductivity is up to 170w/mk, is the highest among all our ceramic materials. Except this, aluminum nitride sheets have similar thermal expansion coefficient with silicon, which will matched perfectly with electronic modules when temperature changes. Adding with the good electrical insulation and dielectric properties, aluminum nitride sheets are ideal material for large scale integrated circuits or high power modules. Any inquiry please email info@mascera-tec.com or call +86 13860446139