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Ceramic substrates play a vital role in the field of electronics due to their significant advantages such as high thermal conductivity, excellent insulation properties, and thermal conductivity.

Advanced ceramics can be further classified into two types based on their characteristics: structural ceramics and functional ceramics.

Zirconia ceramic blades are manufactured using high-purity ultra-fine zirconia as raw material, through processes such as spray granulation, isostatic pressing, and precision machining. They feature high hardness, strong corrosion resistance, good chemical stability, and high wear resistance.

​In the field of modern technology, high-temperature resistant ceramic tubes, as one of the important materials, possess unique characteristics and have extensive applications.

Ceramic materials play an important role in the modern military industry due to their unique properties such as high temperature resistance, high strength, lightweight, electrical and thermal insulation properties, etc. With the advancement of technology and the development of new material technologies, the application scope of ceramic materials is expected to further expand, providing critical solutions to many challenges facing the world today.

Aluminum nitride ceramic materials have broad application prospects and extensive potential markets in various fields such as electronics, electrical power, locomotives, aviation and aerospace, defense and military industries, telecommunications, and numerous industrial sectors. With the continuous advancement and innovation in technology, aluminum nitride ceramics will further expand their applications and developments in various fields.

As manufacturing enters a new development period, the application of ceramic substrates is becoming increasingly widespread, with higher requirements for surface roughness and flatness. The rapid development of laser polishing technology provides a new approach for intelligent and efficient polishing processing of ceramic substrates.

During the laser marking process of ceramic substrates, it is essential to control the laser processing parameters to avoid excessive heating, which may lead to ceramic cracking or deformation. Laser marking offers advantages such as fine seams, high accuracy, fast marking speed, smooth section, small heat-affected zone, and no substrate damage, providing a reliable processing method for ceramic substrate fabrication. As the microelectronics industry continues to evolve towards miniaturization and lightweighting, demanding higher precision, laser marking technology holds great promise for ceramic substrate processing.

As a support base for electronic components, ceramic substrates facilitate heat dissipation in electronic devices. After the initial forming of ceramic substrates, they require further processing such as drilling and scribing. Traditional machining methods cannot meet the high-precision machining requirements of ceramic substrates. With the development of laser processing technology, it is gradually becoming the mainstream for precision machining of ceramic substrates.

Ceramic substrates are commonly used materials for electronic packaging. Currently, several commonly used electronic ceramic substrate materials include alumina (Al2O3), aluminum nitride (AlN), and silicon nitride (Si3N4). Due to the excellent properties of electronic ceramic substrates, they find extensive applications in fields such as electronics, optoelectronics, telecommunications, aerospace, among others.