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​Electronic components operating in harsh environments such as high temperature and high humidity can lead to performance deterioration and even damage. Therefore, effective packaging methods and continuous improvement of packaging materials are required to maintain good stability of electronic components in demanding external conditions.

Active Metal Brazing (AMB) is an advancement of the DBC process. It involves adding a small amount of active elements (e.g., Ti, Zr, V, Cr) to the brazing electronic paste, which is then printed onto the ceramic substrate using screen printing technology.

As the global demand for sustainable energy continues to increase, the new energy industry is rapidly developing. This article will focus on the key applications and developments of DPC (Direct Plating Copper) ceramic substrate technology in new energy production, including its advantages in solar photovoltaics, wind energy generation, and energy storage systems, as well as future trends and challenges.

The development of ceramic sintering technology directly influences the progress of advanced ceramic materials and is an essential key step in ceramic product manufacturing.Based on the research target, sintering can be categorized into solid-state sintering and liquid-phase sintering. Depending on the specific processes, sintering methods include pressureless sintering, hot pressing, hot isostatic pressing, atmosphere sintering, microwave sintering, spark plasma sintering, and others.

In the new energy vehicle industry, the application of various advanced materials is the foundation that supports the entire industry. In this article, we will explore the increasingly important role of ceramics in the intelligentization process of new energy vehicles.

Ceramic metallization refers to firmly adhering a thin layer of metal film to the ceramic surface to achieve welding between ceramic and metal. There are various ceramic metallization processes, including molybdenum-manganese method, gold plating method, copper plating method, tin plating method, nickel plating method, and LAP method (laser-assisted plating).

There are many types of ceramic bearings available that offer numerous advantages over traditional bearing components. Two common ceramic materials used for bearing applications are silicon nitride (Si3N4) and zirconia (ZrO2).

Hexagonal boron nitride (h-BN) is a crystalline structure composed of nitrogen and boron atoms arranged in a hexagonal lattice. It is the only phase of boron nitride that exists naturally in the environment. It appears as a soft, loose, smooth, and moisture-absorbing white powder, and it shares similar layered structure characteristics with graphene, earning it the nickname "white graphite."

Direct Bond Copper (DBC) ceramic substrate has become an important electronic packaging material due to its excellent thermal conductivity and electrical conductivity, especially in power modules (IGBT) and integrated power electronic modules.

Alumina ceramic is the most commonly used ceramic substrate material, favored for its overall good performance. The advantages of alumina ceramic substrates include excellent insulation performance, exceptional high-temperature resistance, high strength and hardness, outstanding chemical stability, and good processability.