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Pyrolytic boron nitride is a new type of ceramic material prepared by chemical vapor deposition (CVD), while hot-pressed boron nitride is prepared by high temperature sintering processes such as pressureless sintering, hot pressing sintering and hot isostatic pressing sintering.

Currently, silicon nitride ceramics used in various fields are primarily prepared through reaction sintering, hot pressing sintering, pressureless sintering, gas pressure sintering, and hot isostatic pressing sintering. Different sintering processes yield silicon nitride ceramics with certain differences in performance, typically applied in different high-temperature structural components, wear-resistant components, or corrosion-resistant components.

In the semiconductor circuit industry, ceramic substrates are one of the main materials for circuit boards. Common ceramic substrates include alumina ceramic substrates, aluminum nitride ceramic substrates, and silicon nitride ceramic substrates. Alumina ceramic substrates and aluminum nitride ceramic substrates have different properties and applications due to their different materials.

Ceramic substrates play a vital role in the field of electronics due to their significant advantages such as high thermal conductivity, excellent insulation properties, and thermal conductivity.

Advanced ceramics can be further classified into two types based on their characteristics: structural ceramics and functional ceramics.

Zirconia ceramic blades are manufactured using high-purity ultra-fine zirconia as raw material, through processes such as spray granulation, isostatic pressing, and precision machining. They feature high hardness, strong corrosion resistance, good chemical stability, and high wear resistance.

​In the field of modern technology, high-temperature resistant ceramic tubes, as one of the important materials, possess unique characteristics and have extensive applications.

Ceramic materials play an important role in the modern military industry due to their unique properties such as high temperature resistance, high strength, lightweight, electrical and thermal insulation properties, etc. With the advancement of technology and the development of new material technologies, the application scope of ceramic materials is expected to further expand, providing critical solutions to many challenges facing the world today.

Aluminum nitride ceramic materials have broad application prospects and extensive potential markets in various fields such as electronics, electrical power, locomotives, aviation and aerospace, defense and military industries, telecommunications, and numerous industrial sectors. With the continuous advancement and innovation in technology, aluminum nitride ceramics will further expand their applications and developments in various fields.

As manufacturing enters a new development period, the application of ceramic substrates is becoming increasingly widespread, with higher requirements for surface roughness and flatness. The rapid development of laser polishing technology provides a new approach for intelligent and efficient polishing processing of ceramic substrates.