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Powder metallurgy and 3D printing are rapidly advancing fields, and boron nitride ceramic nozzles are emerging as noteworthy applications in these domains.

Boron nitride ceramic plays a key role in electric propulsion technology and plasma thrusters, providing essential support for the performance and reliability of the thrusters. Its excellent high-temperature resistance, good insulation properties, and corrosion resistance make it an ideal material choice.

Surface grinding and polishing are often required for ceramic substrates prior to the metallization process, and this can be done on either a single or double-sided basis. This step provides three notable advantages

Due to the large shrinkage during sintering, it is challenging to ensure the dimensional accuracy of ceramic pieces after sintering, including the precise provision of various holes, slots, and edges for assembly purposes. Therefore, post-sintering processing is required. Laser cutting, as a non-contact processing method, ensures that there is no internal stress in the product, resulting in minimal edge chipping, high precision, and high processing yield.

Mascera high purity boron nitride crucibles are suitable for sintering and smelting: 1.Nonferrous & ferrous metals such as Al, Bi, Ge, Sb, Sn, Cd, Pb, Ni, Zn, Cu, Mg, Im, Fe, Stainless Steel... 2.Glass melt, Soda glass, Cryolite 3.Silicon molten salt, fluoride, slag

boron nitride (BN) offers advantages of low wettability, chemical stability, high-temperature stability, and good thermal conductivity in the sintering of aluminum nitride (AlN) and silicon nitride (Si3N4) substrates. These advantages provide a reliable, clean, and high-quality sintering environment, ensuring the substrates are sintered in optimal conditions and maintain the desired performance.

how to implement metallization on ceramic surfaces and improve the bonding strength between the two is the focus of the ceramic substrate metallization process. This article introduces several processes for ceramic substrate metallization.

Ceramic substrates, also known as ceramic circuit boards, include ceramic substrates and metal circuit layers. Common materials for electronic packaging ceramic substrates include aluminum oxide (Al2O3), aluminum nitride (AlN), silicon nitride (Si3N4), and beryllium oxide (BeO).

The main ceramic materials that can be used as bulletproof materials are aluminum oxide, silicon carbide, boron carbide, silicon nitride, and titanium boride. Among them, aluminum oxide ceramics (Al2O3), silicon carbide ceramics (SiC), and boron carbide ceramics (B4C) are the most widely used.

Advanced ceramics have the characteristics of high strength, high hardness, low density, corrosion resistance, and high wear resistance. Compared with metal bulletproof materials, they are lighter in weight and have smaller loads, which is extremely advantageous in individual bulletproof equipment such as bulletproof vests.