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Ceramic substrates, also known as ceramic circuit boards, include ceramic substrates and metal circuit layers. Common materials for electronic packaging ceramic substrates include aluminum oxide (Al2O3), aluminum nitride (AlN), silicon nitride (Si3N4), and beryllium oxide (BeO).

The main ceramic materials that can be used as bulletproof materials are aluminum oxide, silicon carbide, boron carbide, silicon nitride, and titanium boride. Among them, aluminum oxide ceramics (Al2O3), silicon carbide ceramics (SiC), and boron carbide ceramics (B4C) are the most widely used.

Advanced ceramics have the characteristics of high strength, high hardness, low density, corrosion resistance, and high wear resistance. Compared with metal bulletproof materials, they are lighter in weight and have smaller loads, which is extremely advantageous in individual bulletproof equipment such as bulletproof vests.

Zirconia ceramic is a kind of ceramic material made from zirconia (ZrO2). The material has many characteristics, including chemical inertness, high thermal expansion, highzirconium oxide blade abrasion resistance, crack growth resistance, excellent heat insulation, low thermal conductivity and so on. Meanwhile, due to the ceramic blade is sintered from zirconia, it determines its brittleness and low toughness.

Zirconia is one of inorganic non-metal materials which has excellent performance on high temperature resistance, corrosion resistance and wear-resistance, and has been widely used in various areas.

Due to excellent hardness, mechanical strength and heat dissipation, both silicon nitride ceramic and aluminum nitride ceramic can be produced into ceramic substrates which are used for electronic capsulation, meanwhile, they are also different in properties and advantages.

Alumina ceramics is one of the most extensively researched and widely utilized materials among new materials. Apart from its applications in electronics and electricity, and the chemical industry, it finds extensive usage in various high-tech fields such as aerospace, high-temperature industrial furnaces, and composite reinforcement.

Boron nitride is an advanced ceramic material that comes in four different variants, the most common are cubic boron nitride (c-BN) and hexagonal boron nitride (h-BN). According to the different manufacturing process, h-BN can be divided into hot pressing boron nitride (HPBN) and pyrolytic boron nitride (PBN).

At present, there are many kinds of industrial valves, and the commonly used valves for Alumina Ceramic industry are plug valves, gate valves, globe valves, ball valves, etc.

Alumina Ceramic have excellent comprehensive properties, thermal conductivity, insulation, heat dissipation, high temperature resistance, and high pressure resistance. So what are the applications of Alumina Ceramic in the electronics industry?