Ceramic Substrate Series-Ceramic Based Packaging
Electronic components operating in harsh environments such as high temperature and high humidity can lead to performance deterioration and even damage. Therefore, effective packaging methods and continuous improvement of packaging materials are required to maintain good stability of electronic components in demanding external conditions.
Three dominant packaging materials
From the composition of electronic packaging materials, they are mainly divided into metal-based, ceramic-based, and plastic-based packaging materials. Ceramic packaging has great potential in high-density packaging and falls under the category of hermetic packaging. The main materials used are Al2O3, AIN, BeO, and mullite, which have advantages such as good moisture resistance, high mechanical strength, low coefficient of thermal expansion, and high thermal conductivity.
Metal packaging mainly uses materials such as Cu, Al, Mo, W, W/Cu, and Mo/Cu alloys, which have high mechanical strength and excellent heat dissipation performance.
Plastic packaging mainly uses thermosetting plastics, including phenolic, polyester, epoxy, and organic silicon, with advantages such as low cost, lightweight, and good insulation performance.
Advantages of ceramic-based packaging
As a common packaging material, ceramic-based packaging has advantages over plastic and metal packaging:
(1) Low dielectric constant, excellent high-frequency performance;
(2) Good insulation and high reliability;
(3) High strength and good thermal stability;
(4) Low coefficient of thermal expansion and high thermal conductivity;
(5) Excellent gas tightness and stable chemical performance;
(6) Good moisture resistance and less susceptibility to micro-cracking.
Versatile Ceramic Packaging
Ceramic packaging comes in various forms to adapt to different application needs. The main forms include CBAG ceramic ball grid array, FC-CBGA inverted ceramic ball grid array, CQFN ceramic quad flat no-lead package, CQFP ceramic quad flat package, CPGA ceramic pin grid array, and various ceramic substrates. Packaging processes and product types are diversified to meet various downstream application needs.
For example, in the packaging of optical modules, the main packaging processes for TOSA and ROSA include TO coaxial packaging, butterfly packaging, COB packaging, and BOX packaging. TO coaxial packaging is mostly cylindrical, with characteristics of small size, low cost, and simple process, suitable for short-distance transmission, but it also has disadvantages such as difficult heat dissipation. Butterfly packaging is mainly rectangular, with a complex design structure, large shell area, and good heat dissipation, suitable for long-distance transmission. COB, chip-on-board packaging, attaches the chip to the PCB board, achieving miniaturization, light weight, and low cost. BOX packaging belongs to a type of butterfly packaging used for multi-channel parallel transmission. In addition, other common packaging methods include dual in-line package (DIP), leadless chip carrier (LCC), and more.
Regarding ceramic-copper clad laminates, there are mainly DPC direct plated copper substrates, DBC direct bonded copper substrates, AM active metal brazed substrates, and LAM laser rapid activation metallization technology. Due to their high thermal conductivity, gas tightness, and strength, ceramic-copper clad laminates have promising prospects in applications such as power semiconductor IGBTs, lasers, and LED devices.
XIAMEN MASCERA TECHNOLOGY CO., LTD. is a reputable and reliable supplier specializing in manufacturing and sales of technical ceramic parts. We provide custom production and high precision machining for a wide series of high performance ceramic materials including alumina ceramic, zirconia ceramic, silicon nitride, silicon carbide, boron nitride, aluminum nitride and machinable glass ceramic. Currently, our ceramic parts can be found in many industries like mechanical, chemical, medical, semiconductor, vehicle, electronic, metallurgy etc. Our mission is to provide the best quality ceramic parts for global users and it is a big pleasure to see our ceramic parts work efficiently in customers' specific applications. We can cooperate on both prototype and mass production, welcome to contact us if you have demands.
