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During the laser marking process of ceramic substrates, it is essential to control the laser processing parameters to avoid excessive heating, which may lead to ceramic cracking or deformation. Laser marking offers advantages such as fine seams, high accuracy, fast marking speed, smooth section, small heat-affected zone, and no substrate damage, providing a reliable processing method for ceramic substrate fabrication. As the microelectronics industry continues to evolve towards miniaturization and lightweighting, demanding higher precision, laser marking technology holds great promise for ceramic substrate processing.

As a support base for electronic components, ceramic substrates facilitate heat dissipation in electronic devices. After the initial forming of ceramic substrates, they require further processing such as drilling and scribing. Traditional machining methods cannot meet the high-precision machining requirements of ceramic substrates. With the development of laser processing technology, it is gradually becoming the mainstream for precision machining of ceramic substrates.

Ceramic substrates are commonly used materials for electronic packaging. Currently, several commonly used electronic ceramic substrate materials include alumina (Al2O3), aluminum nitride (AlN), and silicon nitride (Si3N4). Due to the excellent properties of electronic ceramic substrates, they find extensive applications in fields such as electronics, optoelectronics, telecommunications, aerospace, among others.

Silicon carbide ceramic materials exhibit excellent properties such as high-temperature mechanical strength, high hardness, strong oxidation resistance, good radiation resistance, excellent wear resistance, thermal stability, low thermal expansion coefficient, and good chemical corrosion resistance. They find wide applications in various fields including industrial machinery, defense, semiconductor, environmental protection, nuclear energy, among others.

In terms of applications, whether in rockets soaring into space or cars racing on highways, or in indestructible cutting tools and robust artificial bones, silicon nitride ceramics have become an indispensable key material in industrial technology, particularly in advanced technology fields. It represents one of the major directions in the development of modern materials science.

In terms of applications, whether in rockets soaring into space or cars racing on highways, or in indestructible cutting tools and robust artificial bones, silicon nitride ceramics have become an indispensable key material in industrial technology, particularly in advanced technology fields. It represents one of the major directions in the development of modern materials science.

Hot-press molding is a widely used forming process in the production of advanced ceramics.It is mainly used to produce small and medium-sized complex structural ceramics, wear-resistant ceramics, electronic ceramics, insulating ceramics, textile ceramics, heat-resistant ceramics, sealing ceramics, corrosion-resistant ceramics, and thermal shock-resistant ceramics.

Ceramic Injection Molding (CIM) is a novel process for manufacturing ceramic components that combines the principles of polymer injection molding with ceramic preparation techniques.

Tape casting, also known as doctor blade casting, is a fundamental ceramic shaping process. Its basic principle involves the flow of ceramic slurry with suitable viscosity and good dispersibility from the slurry trough of a tape caster to the substrate.

Dry pressing is the most widely applied shaping technique, also known as powder pressing, and it is the primary shaping process for specialty ceramics such as microwave dielectric ceramics and semiconductor ceramic components.