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HBN boron nitride plate for precision glass molding

  • HBN boron nitride plate for precision glass molding
  • HBN boron nitride plate for precision glass molding
  • HBN boron nitride plate for precision glass molding
HBN boron nitride plate for precision glass molding
  • MSJ/BN-014
  • boron nitride ceramic
  • customized
  • 5 pcs per type
  • Precision glass molding

A hot-pressed hexagonal boron nitride (hBN) mold by Mascera, designed for precision glass production.With high temperature resistance, low adhesion, and stable dimensions, these molds outperform traditional graphite. Experience extended lifespan, improved efficiency, and enhanced mold stability. Upgrade your glass manufacturing process with our advanced hBN molds, minimizing defects and optimizing mold release.

Any inquiry please email info@mascera-tec.com or call +86 13860446139

Product detail

Boron Nitride Molds

In traditional glass production, graphite is commonly used as a mold material, but it has the following disadvantages: it is prone to wear and oxidation at high temperatures, reducing its lifespan; it has a high coefficient of thermal expansion, resulting in instability in mold precision and dimensions, requiring more frequent adjustments; the surface of graphite has adsorptive properties, leading to adhesion of glass to the mold; in extreme conditions, it has low strength and durability, lacking sufficient strength and durability for high-pressure or high-impact glass molding processes. Coating graphite molds with materials like boron nitride can improve their heat resistance and reduce adhesion, but there are still risks of coating detachment and shorter lifespan.

Hot-pressed hexagonal boron nitride (hBN) is suitable for molds in the production of precision glass products due to the following properties:boron nitride plate

1. High temperature resistance: Hexagonal boron nitride can maintain structural stability in high-temperature environments, enabling molds to withstand the thermal stress of high-temperature glass melting and shaping processes, thereby extending their lifespan.

2. Low adhesion: Boron nitride surfaces have low adhesion, reducing the adhesion and retention of glass to the mold. This helps improve production efficiency and reduce the frequency of cleaning and maintenance.

3. Low coefficient of thermal expansion: Hexagonal boron nitride exhibits relatively stable dimensions at high temperatures, facilitating mold size stability and precision control.

4. High chemical inertness: Boron nitride can resist corrosion and chemical erosion, prolonging the mold's lifespan.

With advancements in hot-pressed boron nitride technology, it has become an ideal material for glass mold production, reducing surface defects, extending mold lifespan, and facilitating mold release.


Main properties

  • Low density

  • High electrical resistivity

  • High thermal conductivity

  • High working temperature

  • Good Machinability

  • Low thermal expansion coeffient

  • Good thermal shock resistance 

  • Good corrosion resistance

  • Non-wetting with metals

  • High breakdown voltage resistance


Material Data Sheet

Material TypeBN-997
BN-99BN-ABN-BBN-CBN-DBN-E

Main Content

BN>99.7%

BN>99%

BN+AL+SI

BN+ZR+AL

BN+SIC

BN+ZRO2

BN+AlN

Color

White

White

Light Grey

Light Grey

Grey Green

Dark Grey

Grey Green

Density (g/cm3)

1.6

1.95-2.0

2.2-2.3

2.25-2.35

2.4-2.5

2.8-2.9

2.8-2.9

Flexural Strength (Mpa)

18

30

65

65

80

90

90

Compressive Strength (Mpa)

45

85

145

145

175

220

220

Electrical Resistivity (Ω.Cm)

>1014

>1014

>1013

>1013

>1012

>1012

>1013

Max. Service Temp. (℃) 

@Air Condition

900

900

900

900

900

900

900

Max. Service Temp. (℃) @Vacuum Condition

1800

1800

1750

1750

1800

1800

1750

Max. Service Temp. (℃) 

@Inert Gas Condition

2100

2100

1750

1750

1800

1800

1750

Thermal Conductivity (W/Mk)

35

40

35

35

45

30

85

Thermal Expansion Coefficient (25 - 1000℃) (10-6/K)

1.5

1.8

2.0

2.0

2.8

3.5

2.8


Tips for Using

1.Working temperature in the air should not exceed 900℃, oxidation will occur when more than 900°C.

2.The components shall be stored in the dry environment inside a sealed container.

3.Never wash the component with water. Use fine sandpaper or cloth to remove any dirts or residues.


Packing & Shipment

Package typecarton box with foam protection
Payment terms

TT / Western Union / Paypal

50% payment in advanced and 50% before shipment

Loading port Xiamen, China
Shipping wayBy sea / air / door-to-door express

Hot pressed boron nitride

Boron Nitride Molds


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